Associate fib-sem engineer

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MITRE’s Electronic Systems Security department is seeking to hire talented and creative professionals with backgrounds in engineering and/or physical sciences and a focus on microelectronics processing to support several different advanced research and development projects of national significance. Qualified candidates will join a team of technical experts in microelectronics security, collaborating with multi-disciplinary teams to advance the state-of-the-art in embedded security. Our diverse set of sponsors and research objectives provide a wide variety of interesting work opportunities.

Roles & Responsibilities:

The Associate FIB-SEM Engineer will have a passion for advancing semiconductor processing and apply their focused ion beam (FIB), plasma focused ion beam (PFIB), and scanning electron microscopy (SEM) technical expertise to:

• Participate in teams that perform hands-on security assessments of embedded systems, and develop new approaches and countermeasures for emerging physical threats to embedded systems.
• Delayer, cross-section, prepare TEM lamellae, and perform circuit edit on chips using state-of-the-art FIB and PFIB systems. Image chips with SEM and optical microscopy.
• Prepare samples for FIB-SEM, e.g. mechanical polishing and sputter coating with thin conductive materials.
• Target specific areas on chips with advanced navigation, per instructions from the microelectronics analysis team.
• Safety - Contribute to a safe laboratory working environment.
• Monitor tool performance and work with tool vendors for preventative maintenance and emergency repair.
• Contribute to process improvements, documentation, and cross-training.

Basic Qualifications:

Typically requires less than 1 year of related experience with a related bachelor’s degree in electrical engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or equivalent combination of related education and work experience.

• Experience with FIB-SEM and/or PFIB-SEM, and the associated sample preparation.
• Effective oral and written communication skills.
• Ability to work independently and as part of a team.
• Attention to detail.
• Prolific at recording technical information in notebooks and internal reports.
• Must be eligible to obtain and maintain a Secret U.S Government issued Security Clearance. Per the U.S. Government’s eligibility requirements, you must be a U.S Citizen to be considered for a security clearance.

This position has an on-site requirement of 5 days a week on-site.

Preferred Qualifications:

Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or a related field.

• Experience with semiconductor reverse engineering and/or failure analysis methods and equipment, such as wet chemistry, vacuum equipment, reactive ion etchers, micro/nanofabrication tools, failure analysis tools, CAD navigation, precision milling and polishing stations, optical microscopy, IR microscopy, and mechanical tools.
• Active security clearance.

This requisition requires the candidate to have a minimum of the following clearance(s): None. This requisition requires the hired candidate to have or obtain, within one year from the date of hire, the following clearance(s): Secret.

Salary compensation range and midpoint:

$80,400 - $100,500 - $120,600 Annual

Work Location Type:

Onsite

Commitment to Non-Discrimination All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran or any other status protected by applicable federal, state, local or international law.

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